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dc.contributor.authorKasturi, Uday Bhaskar
dc.date.accessioned2015-09-22T20:57:15Z
dc.date.available2015-09-22T20:57:15Z
dc.date.issued2004-12
dc.identifier.urihttp://hdl.handle.net/11122/6011
dc.descriptionThesis (M.S.) University of Alaska Fairbanks, 2004en_US
dc.description.abstractA flip chip package, underfilled or non-underfilled, was analyzed under mechanical shock and/or vibration at the device and board levels, respectively. For the tests at the device level, the maximum stress developed at the corner-most solder joint. The horizontal drop orientation, with the chip facing up, produced the worst scenario for solder joint lifetime prediction. The underfilled package is better than non-underfilled under the excitation of mechanical shock and vibration. Parametric studies of the underfill material strength suggested that the higher the elastic modulus, the better it carried the mechanical shock. However, practically the upper bound of the elastic modulus is limited to avoid die cracking due to thermal mismatch of material expansion. The combined loading of thermal residual stress and mechanical shock was also conducted to study their influence on the solder lifetime prediction. It was found that the thermal pre-stressed condition plays a key role for the von Mises stress excursion, but has almost no influence on the shock-induced normal stress. The phenomenon appears similarly in the board level testing, but with worse reliability in solders due to the higher stresses induced.en_US
dc.description.tableofcontents1. Flip chip packaging technology -- 2. Shock analysis of a generic flip chip model -- 3. Vibration analysis of the flip chip package -- 4. Shock analysis of a flip chip under extreme temperature environment -- 5. Shock and vibration tests at board level -- 6. Conclusions and future work -- References -- Appendix.en_US
dc.language.isoen_USen_US
dc.titleAnalysis of a generic flip chip under shock and vibrationen_US
dc.typeThesisen_US
dc.type.degreemsen_US
dc.identifier.departmentDepartment of Mechanical Engineeringen_US
dc.contributor.chairChen, Cheng-fu
dc.contributor.committeeButcher, Eric
dc.contributor.committeeLin, Chuen-Sen
refterms.dateFOA2020-03-05T08:56:16Z


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