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Browsing College of Engineering and Mines (CEM) by Author "Kasturi, Uday Bhaskar"

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Browsing College of Engineering and Mines (CEM) by Author "Kasturi, Uday Bhaskar"

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  • Kasturi, Uday Bhaskar (2004-12)
    A flip chip package, underfilled or non-underfilled, was analyzed under mechanical shock and/or vibration at the device and board levels, respectively. For the tests at the device level, the maximum stress developed at the ...

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